Single-electrode chips have very high requirements for solid crystal in the packaging industry. For example, in the LED production process, the quality of the solid crystal affects the quality of the finished LED products. There are many factors that cause LED solid crystal cracking. We only discuss the solution of LED solid crystal cracking from three factors: material, machine and man-made.
First, the chip material itself rupture phenomenon chip damage is greater than 1/5 of the width of the single-sided chip or the damage is at the oblique angle, each side is longer than 2/5 chip or damaged to the aluminum pad, such chips are not acceptable (this is the chip An item in the inspection standard). The main causes of the bad phenomenon are:
1. The chip manufacturer is not working properly
2. Chip incoming inspection has not been sampled
3. The solution was not picked out during online operation:
1. Inform the chip manufacturer to improve
2 Strengthen the feed inspection, and reject the chip with too much damage.
3. When the Q test is performed online, the broken chip should be picked out and the good chip should be added.
Second, the LED solid crystal machine is used improperly
1. The suction height of the machine is not controlled. The nozzle height and the solid crystal height of the machine are directly controlled by the parameters in the computer. The parameters are large, the suction height is small; the parameters are small, the suction height is large, and the chip is damaged or not, which is directly affected by the suction height parameter of the machine. The main reasons for the bad phenomenon are: large parameters of the machine, low hunting height, excessive force on the chip, resulting in chip damage.
Solution:
Adjust the parameters of the machine, and appropriately increase the height of the nozzle or the height of the solid crystal. Adjust the height of the nozzle in the first “Pick Level†in the “Bond head menu†in the “SETUP†mode of the machine, and then in the second item. Bond Level" adjusts the solid crystal height.
2, the size of the nozzle does not match the size of the chip to be fixed with different nozzles. Large chips can be easily leaked with small nozzles and chips. Small chips can be easily broken with large nozzles and chips. Therefore, the selection of appropriate nozzles is a prerequisite for solid chips. The cause of the bad phenomenon is that the nozzle is too big to break the chip.
Solution: Choose the appropriate porcelain nozzle.
Third, artificial rupture caused by improper operation
A. Improper operation did not operate according to the regulations, so that the chip was broken. The main causes of the bad phenomenon are:
1. The material is not taken well and dropped to the ground.
2. When you enter the oven, you will encounter the chip. Solution: When taking the material, keep your hands steady. When entering the oven, the material should be flat and gently put in. Do not tilt or use excessive force.
B. The heavy object is damaged by the external force and the chip is broken. The main reasons for this kind of bad phenomenon are:
1. The microscope falls onto the material, breaking the chip
2. The machine parts are dropped onto the material.
3. Iron plate pressed to material solution:
1. The microscope screw should be locked
2. Regularly check the machine parts for looseness.
3. There must be no objects such as iron plates on the material.
Rubber Binder,Rubber Adhesives,T45 Rubber Binder
Foshan Lanxun Trading Co., Ltd. , http://www.chpigmentpaste.com