Companies and consumers associated with the off-grid lighting market in sub-Saharan Africa have found that issues related to access to finance are often the biggest obstacles in the supply chain. Illuminating Africa recognizes the importance of funding in the project and is working to identify financing needs for stakeholders and to inform project members about relevant solutions and the latest developments in the appropriate financial products market.
Now, illuminate financing information, products and services that Africa is working to develop include:
1. Study the market's demand for financial products and potential markets, obtain a clear market, and share relevant information with fundraising partners on this basis.
2. Develop credit lines to support local supply chain financing based on local financial partners. Helping and supporting supply chains in the African market for commercial financing through the design and implementation of funding programs.
3. Providing equity financing to support companies in providing modern off-grid lighting; or through direct corporate finance, commercial seed capital or equity, enabling companies to produce, sell or finance modern off-grid lighting products to achieve innovation and expand market business models.
4. Develop and implement trade finance funds to support the import of modern lighting products or components. The trade finance mechanism for the development and operation of the African market will support importers and exporters in the trade of modern lighting products and components, helping to speed up the import of qualified products and modern lighting components.
5. Provide research and research opportunities to enable companies to obtain carbon credits through voluntary and compliance with carbon market programs. Develop a method for sub-Saharan Africa and a low-cost, cost-effective way to obtain carbon credits to reduce carbon dioxide emissions, replacing modern fuel-based lighting with modern lighting (focusing on light-emitting diodes) (eg , kerosene, candles).
6. Funding for innovative lighting products and delivery services. Through the commemoration of the African Development Market Competition from 07 to 08, we funded the innovation of 16 award-winning early stages; these innovations are aimed at building sustainable non-fossil fuel-based lighting projects in sub-Saharan Africa.
What is the illuminating African plan?
Please click: China Photo Enterprises can enter the African market by illuminating the African plan
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HDI PCB Specification
High density interconnect (HDI) PCBs represent one of the fastest-growing segments of the printed circuit board market. Because of its higher circuitry density, the HDI PCB design is able to incorporate finer lines and spaces, smaller vias and capture pads, and higher connection pad densities. A high density PCB features blind and buried vias and often contains microvias that are .006 in diameter or even less.
HDI PCBs are characterized by high-density attributes including laser microvias, fine lines and high performance thin materials. This increased density enables more functions per unit area. Higher technology HDI PCBs have multiple layers of copper filled stacked microvias (Advanced HDI PCBs) which creates a structure that enables even more complex interconnections. These very complex structures provide the necessary routing solutions for today's large pin-count chips utilized in mobile devices and other high technology products.
The HDI PCBs we offer include the following highly requested characteristics:
Blind and/or buried vias
Via-in-pad
Through vias from surface to surface
20 µm circuit geometries
30 µm dielectric layers
50 µm laser vias
125 µm bump pitch processing
Applications
HDI PCB is used to reduce size and weight, as well as to enhance electrical performance of the device. HDI PCB is the best alternative to high layer-count and expensive standard laminate or sequentially laminated boards. HDI incorporate blind and buried vias that help to save PCB real estate by allowing features and lines to be designed above or below them without making a connection. Many of today's fine pitch BGA and flip-chip component footprints do not allow for running traces between the BGA pads. Blind and buried vias will only connect layers requiring connections in that area.
HDI PCB
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