NXP Semiconductors NV (NASDAQ: NXPI) today announced breakthroughs in eSIM solutions that are compliant with the GSMA standard, enabling device manufacturers to more easily provide consumers with SIM remote configuration and multiple mobile A wireless update subscribed by a network operator (MNO). NXP's latest chip innovations cater to the needs of the steadily eSIM market. According to ABI Research's data (December 2017), the market is expected to grow nearly seven-fold, and shipments will increase from a relatively small 224 million in 2018 to 696 million in 2022. Let's take a look at the related content with Xiaobian.
The new NXP SN100U is the world's first single-die chipset with integrated embedded security (SE), near field communication (NFC) and eSIM for enhanced advanced features, cellular connectivity and increased security. NXP also introduced the industry's smallest footprint SU070 stand-alone eSIM solution, ideal for smartphones, tablets, laptops and other IoT devices that require low-power cellular connectivity. Both new eSIM solutions offer the highest level of end-to-end security from hardware to software, providing consumers, original equipment manufacturers (OEMs), MNOs and service providers with secure, tamper-proof data protection.
Rafael Sotomayor, senior vice president and general manager of the secure transaction and identity line at NXP, said: "The increase in 5G cellular devices and the trend toward consumer-oriented IoT have opened up new possibilities for new devices and services. These devices add eSIM capabilities will become smarter, more independent, and require greater security, performance and reliability. As a leading provider of secure IoT solutions, we have integrated best-in-class security, NFC and connectivity capabilities into a single The unique ability in the die makes it easy to configure remotely."
SN100U - the highest level of integrationThe highly integrated SN100U chipset with integrated SE, NFC and eSIM is designed to provide OEMs with a more convenient and cost-effective solution to integrate more demanding applications in future devices, such as mobile transmission and smart access control. Control, contactless payment and higher platform security. MNOs, OEMs, and original design manufacturers (ODMs) want new, feature-rich devices that combine performance, standard compatibility, and security. The multi-interface and security software features of the product are a particularly suitable option for them. The SN100U extends the life of these connected devices with significantly increased read/write cycles, multi-interface concurrency management, and significant power savings, benefiting MNOs and their customers.
SU70 - minimum footprint and lowest power consumptionCompared to existing solutions, the SN100U and SU070 chipsets have a footprint reduction of up to 30% on printed circuit boards, eliminating the need for SIM cards/gates for traditional SIM cards and enabling extremely low power Consumption. In particular, SU070, ideal for wearables and other small mobile-connected devices, offers a low-power feature that reduces power consumption by up to 75% compared to competing eSIM solutions. With this flexibility, MNOs can explore more types of mobile cellular interconnect device services.
By driving the convergence of eSIM and SE capabilities, end users will benefit from a more convenient and safer lifestyle, for example, seamless NFC mobile payments while keeping their mobile calls.
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