The Lamp-LED package is in the form of a potting. The potting process is to first inject liquid epoxy into the LED molding cavity, then insert the pressure-bonded LED bracket into the oven to cure the epoxy, and then remove the LED from the cavity to form. The LED potting process seems to be very simple, but pay attention to the following aspects:
1. Mount the mould strip on the aluminum boat in a certain direction. After the dust is blown, it is placed in an oven at 125 ° C / 40 minutes for preheating.
2. According to the demand of the production, the glue is mixed, and then the prepared glue is evenly stirred and placed in a vacuum oven at 45 ° C / 15 minutes for defoaming.
3. After the glue is applied, the initial baking is carried out (the initial baking temperature of the products of 3φ, 5 φ is 125 °C / 60 minutes?); the initial baking temperature of the products of 8 φ -10 φ is 110 °C / 30 minutes?? +125 °C /30 points??) 4. Perform the release mold, and then carry out long baking at 125 °C / 6-8 hours.
If the glue is poor, the following phenomena may occur:
1. Bracket insertion, bracket insertion depth, bracket insertion shallow, bracket insertion, bracket creeping, bracket yellowing (oxidation, baking temperature is too high or too long) 2. Bowl bubbles, pearl bubbles, linear bubbles, surface Pinhole bubble 3. Impurity, multi-glue, less glue, atomization 4. Glue surface water stain, colloid damage, colloid crack (glue aging or proportion is wrong), colloid yellowing (A glue ratio is too large).
1. Mount the mould strip on the aluminum boat in a certain direction. After the dust is blown, it is placed in an oven at 125 ° C / 40 minutes for preheating.
2. According to the demand of the production, the glue is mixed, and then the prepared glue is evenly stirred and placed in a vacuum oven at 45 ° C / 15 minutes for defoaming.
3. After the glue is applied, the initial baking is carried out (the initial baking temperature of the products of 3φ, 5 φ is 125 °C / 60 minutes?); the initial baking temperature of the products of 8 φ -10 φ is 110 °C / 30 minutes?? +125 °C /30 points??) 4. Perform the release mold, and then carry out long baking at 125 °C / 6-8 hours.
If the glue is poor, the following phenomena may occur:
1. Bracket insertion, bracket insertion depth, bracket insertion shallow, bracket insertion, bracket creeping, bracket yellowing (oxidation, baking temperature is too high or too long) 2. Bowl bubbles, pearl bubbles, linear bubbles, surface Pinhole bubble 3. Impurity, multi-glue, less glue, atomization 4. Glue surface water stain, colloid damage, colloid crack (glue aging or proportion is wrong), colloid yellowing (A glue ratio is too large).
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