In terms of performance, Thunderbird TV I55C is in line with the Internet's "speed" feature, the second fastest response. It is equipped with the Mstar838A high-performance 64-bit processor, equipped with Cortex A53 quad-core 1.7G hertz CPU and T820GPU, plus 4K video decoding technology of 60 frames per second and 2GB DDR3+16GB eMCC5.0 high-end memory combination, allowing consumption to watch regardless of Ultra-clear video or playing large-scale 3D games can enjoy a clear and smooth experience.
Intelligence is a highlight of the Thunderbird TV I55C. It has a deeply optimized FFUI system that allows consumers to easily search for the desired video. It also uses intelligent voice technology that can be controlled remotely with sound, making the operation simple. In addition, with the content cooperation with Tencent video, Thunderbird TV I55C also has more than 600 million hours of genuine copyright movies, television dramas and other mass content.
In addition, from the perspective of design, Thunderbird TV I55C is also a pleasing living room artwork. It uses innovative curved screen design, aviation aluminum micro frame, integrated lightweight body, with diamond slices, round and round, give people a refreshing visual experience. It is also equipped with a triangular metal hollow base that meets engineering principles and is light and smart. The crescent-shaped breathing lamp exhibits a rhythm and rhythm between a call and a breath, adding an elegant atmosphere to the overall quality of the Thunderbird TV I55C.
It is reported that TCL TV shipped more than 20 million units worldwide in 2016, ranking third in the world. Thunderbird is the first Internet brand launched by TCL Corporation. In March this year, Thunderbird TV I55, I49 and many other products were launched. Thunderbird TV not only enjoys the strength of TCL Group’s own funds, R&D, etc., but also shares TCL's service network throughout the world and provides high-quality after-sales services to restructure the new business model of the Internet era with “product + content + serviceâ€. Thunderbird TV, with its strong strength, may become the "new domestic product" of Internet TV.
The launch of the first domestic aircraft carrier and the launch of the first large passenger aircraft... It can be seen that China’s scientific and technological R&D and manufacturing processes are constantly upgrading. The curved screen of the Thunderbird TV I55C shows yet another advancement of "China's intellectual creation."
Since May 25 th , Thunderbird TV I55C will be fully sold in Jingdong Mall. Interested consumers can go to make an appointment to purchase.
Smart TV/box information can focus on smart TV information network sofa butler (http://), China's influential TV box and smart TV website, providing information, communication, TV boxes, smart TVs, smart TV software, etc. Answering questions.
How is metal core PCB made?
A traditional printed circuit board (PCB, Printed Circuit Board) is composed of a copper layer, epoxy resin, and glass fiber cloth. Among them, epoxy resin and glass fiber cloth are both poor thermal conductors and poor heat dissipation performance. If working at high temperature for a long time, epoxy resin will accelerate aging, which will greatly shorten the service life of the printed circuit board. The coefficient of expansion between the oxygen resin and the glass fiber cloth is inconsistent, and the possibility of functional obstacles when working at high temperatures is greatly increased. The existing printed circuit boards with metal bases are arranged on one side of the printed circuit board. . Although this arrangement can achieve the purpose of heat dissipation, the heating components are relatively far from the metal base, and the heat conduction is relatively slow, which affects the heat dissipation effect. Therefore, it is necessary to provide a metal core circuit board with good heat dissipation effect to solve the above technical problems.
Technical realization elements:
The embodiment of the utility model provides a metal core circuit board with good heat dissipation effect; to solve the technical problem of poor heat dissipation effect of the existing metal core circuit board.
The embodiment of the present invention provides a Metal Core PCB (MCPCB), which includes:
The metal core includes a first surface and a second surface disposed opposite to the first surface;
A first circuit board arranged on the first surface, the first circuit board comprising a first carrying layer arranged on the first surface and a first circuit layer formed on the first carrying layer;
A second circuit board arranged on the second surface, the second circuit board comprising a second carrying layer arranged on the second surface and a second circuit layer formed on the second carrying layer;
The heat dissipation hole body is used for dissipating heat of components with a large amount of heat. The heat dissipation hole body penetrates from the first circuit layer to the second circuit layer. The heat dissipation hole body includes a heat dissipation through hole covering the A first insulating layer on the inner wall of the heat dissipation through hole and a heat dissipation layer provided on the first insulating layer;
At least one of the Electronic Components is connected to the heat dissipation layer.
In the present invention, the heat dissipation layer has a cylindrical structure, and both ends of the heat dissipation layer are provided with ring-shaped lugs in the outer circumferential direction, and the Electronic Components are connected to the lugs through a pin .
In the present invention, the heat dissipation layer is surrounded and defined to form a heat dissipation space, and a phase change material is sealed in the heat dissipation space.
In the present invention, the first supporting layer is connected to the first surface through an adhesive layer.
In the present invention, the second supporting layer is connected to the second surface through an adhesive layer.
In the present invention, the metal core circuit board further includes a through hole penetrating the metal core circuit board, and the hole wall of the through hole is covered with a copper layer, the copper layer and the first circuit layer Electrically connected to the second circuit layer;
Wherein, the copper layer is connected to the metal core through a second insulating layer.
In the present invention, the first surface and the second surface are both roughened surfaces.
In the present invention, the first circuit layer and the second circuit layer are both made of copper.
In the present invention, the adhesive layer is a pure glue prepreg.
Compared with the metal core circuit board of the prior art, the metal core circuit board of the present invention improves the heat dissipation efficiency of the present invention through the arrangement of the heat dissipation hole; it solves the poor heat dissipation effect of the existing metal core circuit board Technical issues.
In order to explain the embodiments of the present invention or the technical solutions in the prior art more clearly, the following briefly introduces the drawings needed in the embodiments. The drawings in the following description are only part of the embodiments of the present invention. For those of ordinary skill in the art, without creative work, other drawings can be obtained based on these drawings.
Please refer to the drawings in the drawings, where the same component symbols represent the same components. The following description is based on the specific embodiments of the present utility model illustrated, and should not be regarded as limiting other specific embodiments of the present utility model that are not described in detail herein.
The metal core 10 includes a first surface and a second surface disposed opposite to the first surface;
The first circuit board 20 is disposed on the first surface. The first circuit board 20 includes a first carrier layer 21 disposed on the first surface and a first circuit layer 22 formed on the first carrier layer 21; a second circuit board 30 Disposed on the second surface, the second circuit board 30 includes a second carrier layer 31 disposed on the second surface and a second circuit layer 32 formed on the second carrier layer 31;
The heat dissipation hole body 40 is used for dissipating heat from the components 50 that generate a large amount of heat. The heat dissipation hole body 40 penetrates from the first circuit layer 22 to the second circuit layer 32. The heat dissipation hole body 40 includes a heat dissipation through hole 41 covering the heat dissipation through hole 41 The first insulating layer 42 on the inner wall and the heat dissipation layer 43 provided on the first insulating layer 42;
At least one component 50 is connected to the heat dissipation layer 43.
In this embodiment, through the arrangement of the heat dissipation hole body 40, the component 40 is connected to the heat dissipation hole body 40 through a pin, so that the heat of the component 40 is transferred to the heat dissipation hole body 40 for heat dissipation, thereby improving The heat dissipation efficiency of this embodiment.
In addition, the arrangement of the metal core 10 enables the printed circuit board to have good heat dissipation, electromagnetic shielding ability, and thermal stability at high temperatures. At the same time, the metal core 10 is arranged between the first circuit board 20 and the second circuit board 30, and is connected by the adhesive layer 60. When the printed circuit board works alternately in a high temperature state and a low temperature state, the first The directions of the internal stresses of the surface and the second surface are opposite and cancel each other, so that the metal core 10 and the adhesive layer 60 form a stable connection, avoiding the occurrence of delamination.
The arrangement of the first insulating layer 42 has an insulating effect on the metal core 10. The arrangement of the heat dissipation layer 43 achieves a good heat dissipation effect. The optional heat dissipation layer 43 is a metal layer, preferably an aluminum layer.
In this embodiment, the heat dissipation layer 43 has a cylindrical structure, and the two ends of the heat dissipation layer 43 are provided with ring-shaped lugs 431 in the outer circumferential direction, and the component 50 is connected to the lugs 431 through a pin. The arrangement of the lugs 431 not only increases the connection area between the heat dissipation layer 43 and the component 50, but also improves the stability of the heat dissipation layer 43 on the first insulating layer 42.
The heat dissipation layer 43 surrounds and defines a heat dissipation space, and a phase change material 44 is sealed in the heat dissipation space. The arrangement of the phase change material enables the heat transferred from the component 50 to be absorbed by the phase change material under the transfer of the heat dissipation layer 43, so as to achieve the purpose of heat dissipation. Of course, in the present invention, the phase change material may not be provided in the heat dissipation space, and natural ventilation is used to dissipate heat. However, the efficiency of natural ventilation and heat dissipation is not ideal.
In this embodiment, the first supporting layer 21 is connected to the first surface through the adhesive layer 60. The second supporting layer 31 is connected to the second surface through an adhesive layer 60. The adhesive layer 60 is a pure glue prepreg.
Further, both the first surface and the second surface are roughened surfaces. For example, when the metal core 10 is an aluminum base, a roughened layer can be formed on the surface of the aluminum base through anodizing treatment, so that the connection stability between the metal core 10 and the adhesive layer 60 can be strengthened, and the bonding of the two can be improved. force.
In this embodiment, the metal core circuit board further includes a through hole 71 penetrating the metal core circuit board. The wall of the through hole 71 is covered with a copper layer 72. The copper layer 72 is connected to the first circuit layer 22 and the second circuit layer. 32 is electrically connected; wherein the copper layer 72 is connected to the metal core 10 through the second insulating layer 73.
In this embodiment, both the first supporting layer 21 and the second supporting layer 31 are made of insulating materials.
In this embodiment, both the first circuit layer 22 and the second circuit layer 32 are made of copper.
The manufacturing process of this embodiment is:
Firstly, the metal core 10 is drilled to form the heat dissipation through hole 41 and the through hole 71 on the subsequent printed circuit board, and then the drilling of the through hole 71 is filled with insulating resin;
Then, the first circuit board 20 and the second circuit board 30 are respectively laminated and connected to the first surface and the second surface of the metal core 10 through the adhesive layer 60;
Then, the through hole 71 is covered with heavy copper, so that the first circuit layer 22 and the second circuit layer 32 are connected;
Next, drill the printed circuit board to open through holes 71 and heat dissipation through holes 41, and cover the heat dissipation through holes 41 with insulating resin to form the first insulating layer 42; then the inner holes are formed in the first insulating layer 42 The heat dissipation layer 43 and the phase change material are filled and sealed.
Finally, the first circuit layer 22 and the second circuit layer 32 on the printed circuit board are etched to form circuits.
In this way, the manufacturing process of this embodiment is completed.
Compared with the metal core circuit board of the prior art, the metal core circuit board of the present invention improves the heat dissipation efficiency of the present invention through the arrangement of the heat dissipation hole; it solves the poor heat dissipation effect of the existing metal core circuit board Technical issues.
In summary, although the present utility model has been disclosed as above in preferred embodiments, the above preferred embodiments are not intended to limit the present utility model. Those of ordinary skill in the art, without departing from the spirit and scope of the present utility model, will do all Various changes and modifications can be made, so the protection scope of this utility model is subject to the scope defined by the claims.
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