[High-tech LED reporter He Wei Guangzhou report] On August 17, the LED industry chain procurement matching conference-materials and equipment held in conjunction with the 2012 Gaogong LED Exhibition was successfully held in the afternoon of the opening day of the exhibition. Exhibitors from the middle and upper reaches of the LED industry chain presented their new products and the characteristics and applications of the main products in the market, effectively promoting the centralized face-to-face technical exchange and procurement between exhibitors and buyers. Docking.
The presentations of the matchmaking conference involved upstream sapphire wafer growth, cutting, dicing equipment, mid-stream packaging and testing equipment, as well as phosphors, encapsulants, and heat-dissipating materials.
LED Industry Chain Procurement Matchmaking Meeting - Materials and Equipment
At the meeting, the marketing director of Guoyan High Energy (Beijing) Steady-state Heat and Mass Transfer Technology Research Institute Co., Ltd. was kicked off with a keynote speech on “Mastering Advanced Cooling Technologyâ€. The characteristics of super-thermal conduction phase change heat dissipation technology on the heat dissipation design concept and the characteristics of the phase change heat sink of the lighting product have proposed a new concept of heat dissipation modularization, module weight reduction and integration of conduction and dispersion. He pointed out that the National Research Institute's high-energy superconducting phase-change radiator has a heat sink with a uniform temperature plate inside. It is also a uniform temperature plate with heat-dissipating fins. It is the perfect fusion of the uniform temperature plate technology and the traditional aluminum heat sink. The heat dissipation performance of the product is 38% higher than that of the heat pipe radiator, and 21% higher than the heat sink heat sink.
Guoyan High Energy Marketing Director
For the heat dissipation technology, Li Lei, the general manager of Zibo Yinhe High-tech Development Co., Ltd., has its own unique insights. Li Lei analyzed the influence of thermal resistance of high-power LED packaging system on LED performance, and systematically expounded the structural characteristics of metal core printed circuit board materials, metal-based insulating board materials, metal matrix composite materials, ceramic copper-clad materials (DBC) and so on. Thermal conductivity. He believes that traditional packaging materials have certain limitations, and composite materials have excellent comprehensive performance, which can meet the requirements of high-power LEDs for heat dissipation. It is the focus of future research on packaging materials, especially ceramic-based composite materials (DBC). It has a broader application prospect, and he also pointed out that optimizing the preparation process and reducing the production cost are the problems that need to be solved.
Li Lei, general manager of Linyi Yinhe High-tech Development Co., Ltd.
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