ON Semiconductor has partnered with Teledyne Imaging Sensors to create an ultra-large junction read integrated circuit (ELS ROIC) for astronomical research. Teledyne's H4RG-15 image sensor is the latest generation of developments for up to 20 years, funded by the National Science Foundation (NSF), NASA and Teledyne for development in astronomy The larger and stronger infrared sensor studied.
The 16-megapixel H4RG-15 contains Teledyne's HgCdTe detector material, which is the largest sensor ever produced for infrared astronomical applications. An enabling technology for the H4RG-15 is the use of ON Semiconductor's proprietary 180 nm process technology to fabricate and reliably produce CMOS read integrated circuits (ROICs) with 63 mm x 63 mm junctions. This ROIC is so large that a 200 mm wafer can hold only four ROIC dies.
The high yields of these ELS ROICs can be attributed to the know-how and technology and yield improvement results of the ON Semiconductor wafer fabrication team and the company's custom foundry division. The HR4G-15 reads ROIC at the wafer fabrication facility in ON Semiconductor, Gresham, Oregon, USA. ON Semiconductor's project demonstrates the company's ability to successfully produce H4RG-15 image sensors with yields that meet next-generation sensor requirements.
H4RG-15 has been installed at the Mauna Kea Observatory at the University of Hawaii to confirm the performance of this sensor under telescope observation conditions. Dr. Donald Hall of the University of Hawaii's Astronomy School, the chief scientist of the NSF-funded H4RG-15 development project, said: "The resolution of the images that can be captured using this new sensor system is an important step forward in the development of infrared astronomical observations."
The H4RG-15 is the latest generation of the highly successful HxRG series of image sensors developed by Teledyne for leading ground and space astronomical observatories, including the Hubble Space Telescope, the James Webb Space Telescope and major ground stations.
"H4RG-15 is critical to the next generation of ground-based telescopes," said Richard Blank, senior project manager at Teledyne's H4RG-15. "The H4RG-15 will be used in the future to design a 30-meter telescope (ELT) and future space missions."
James BeleTIc, vice president of space and astronomy at Teledyne Imaging Sensors, said: "We value the partnership with ON Semiconductor, which is critical to the successful development of H4RG-15."
Rocke Acree, Manager of Custom Fabric Foundry Division, ON Semiconductor, said: "The success of H4RG-15 ROIC is a strong testament to our wafer foundry capabilities and CMOS imaging process capabilities. H4RG for Teledyne Imaging Sensors -15 ROIC is one of the largest CMOS chips ever. The innovative bonding process used by ON Semiconductor for this project enabled us to develop smaller building blocks to produce sensors with larger physical dimensions. This project highlights ON Semiconductor The breadth and depth of technical capabilities available to the market can meet even the most demanding application requirements."
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