The traditional LED packaging process is to bond the LED chip on the heat-dissipating substrate, connect the wires through Wire Bonding or Flip Chip, and finally form the glue and mold ( Molding) and other methods of coating the LED chip to form the LED die, and finally fixing the die on the circuit board, and integrating the power, heat sink, lens (Lens) and reflector cup (reflector) constitutes a complete lighting module.
Figure 1: LED package schematic
Table 1: Comparison of various boards
In the lighting module, the heat received by the substrate and the circuit carrier is the most dense, so the substrate directly contacting the heat source uses ceramic as the material, and when the power is higher and the components are getting smaller, the ceramic Circuit boards are also being used in large numbers. As shown in Table 1, ceramic circuit carriers have more advantages than traditional circuit boards for LED lighting, and can be applied to LED lighting such as high power (HP), high voltage (HV) and alternating current (AC). Higher energy conversion rate or no need for power converters, so the integration of the two technologies can not only improve the stability of LED lighting, but also reduce the overall cost of the whole, making it easier to import into the home lighting market.
However, as the demand for larger illumination in a small volume increases, the single crystal package has not met the future demand, so COB (Chip On Board) LED packaging technology has followed, and the conventional chip needs to be fixed on the substrate and integrated in the circuit. The package of the carrier board is different. As shown in Figure 1, the COB package directly encapsulates one or more LED dies on the circuit carrier board. The thermal ohm theorem ΔT=QR, temperature difference = heat flow x thermal resistance, The greater the thermal resistance, the greater the heat is generated in the component. Therefore, the COB packaging method can eliminate the use of the package substrate and reduce the number of layers of the lighting module to enhance the heat dissipation performance of the LED.
This technology can solve the high heat generated by a single high-power package, which has the advantages of low thermal resistance, low assembly cost and high lumen output of a single package. Nowadays, it has been widely used in lighting fixtures, but due to the large amount of chips generated. The heat will directly contact the COB substrate. Therefore, when a higher illumination module is required, the COB produced by the old aluminum plate (MCPCB) technology may have a problem that the thermal expansion coefficient does not match and the thermal tilt is caused. Therefore, the introduction of the ceramic substrate technology is introduced. There is an imperative demand.
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