Spansion Industry's Single-Chip Highest Capacity Flash Memory Chip

Spansion, Inc., a provider of professional parallel and serial NOR flash memory chips, recently announced that it has begun to measure the highest capacity flash memory chips for single die in the industry. The chip is a 512 Mb Spansion® FL-S serial (SPI) NOR flash memory. Spansion serial flash memory chips have leading read and write performance, automotive application-grade high quality and temperature characteristics, support higher density, and have flash file system software and long-term product support to support, thus becoming the first choice for many engineers. In order to improve the user experience and provide innovative, graphic rich, personalized design, many customers have put forward more requirements for the above characteristics.

Spansion FL-S series products have capacities from 128Mb to 1Gb, with industry-leading programming speed three times faster than competitive products and double data read rate (DDR) of 20% faster. The increase in speed has greatly improved the user experience in many embedded applications such as car dashboards and infotainment systems, industrial and medical graphic displays, and home gateways and set-top boxes.

Benefit from Spasnion FL-S product characteristics, many applications can provide better products, including:

Cars: A combination dashboard and infotainment system based on a 3D graphics engine that displays real-time driving letters and high-reliability instructions, real-time fast rendering, and fewer pin counts. These features are necessary to achieve a personalized design, improve the graphics display, and start the digital dashboard instantly.

Consumer electronics: Home gateways, digital televisions, set-top boxes, and printers all require high-capacity serial flash and advanced encryption protection in a smaller package, providing the end user with a secure, instant-on user experience.

· Smart meters: To monitor energy use, more and more code needs to be implemented on a cost-effective platform and provide high reliability for the system.

WiMax system: The demand for smaller packages is growing, such as BGA packages with high reliability.