High-power high-brightness LED conductive silver paste and its packaging technology

A large power high brightness LED conductive adhesive, conductive silver glue

Conductive adhesive is an indispensable glue in LED production and packaging. Its requirements for conductive silver paste are electrical and thermal conductivity. The shear strength is large and the adhesion is strong.

As the leading brand of high-end electronic binders in the world, UNINWELL International develops conductive adhesives and conductive silver adhesives with good electrical conductivity, strong shearing force, good rheology and low moisture absorption. Especially suitable for high power high brightness LED packaging.

The company's specially developed 6886 series conductive silver adhesive is especially suitable for high-power high-brightness LEDs. The thermal conductivity is: 25.8. The shear strength is: 14.7, which is the best in the industry.

Two LED packaging technology

1 Introduction

LED is a kind of light-emitting device that can directly convert electric energy into visible light and radiant energy. It has low working voltage, low power consumption, high luminous efficiency, short response time, pure light color, firm structure, impact resistance and vibration resistance. With stable and reliable performance, light weight, small size and low cost, the company has developed rapidly and is now able to mass produce high-brightness and high-performance products of various colors in the visible spectrum. Domestically produced red, green, orange and yellow LEDs account for about 12% of the world's total. The industry goal during the "10th Five-Year Plan" period is to achieve an annual output of 30 billion, achieving ultra-high brightness AiGslnP LED epitaxial wafers and chips. Large-scale production, with an annual output of more than 1 billion red, orange and yellow super high-brightness LED dies, breaking through the key technologies of GaN materials, achieving medium-to-large production of blue, green and white LEDs. It is predicted that by 2005, the international market demand for LED will be about 200 billion, with sales reaching 80 billion US dollars.

In the LED industry link, upstream is the production of LED substrate wafers and substrates. The industrialization of the midstream is LED chip design and manufacturing, downstream LED packaging and testing, research and development of low thermal resistance, excellent optical characteristics, and highly reliable packaging technology. The new LED is going to be practical and the market-oriented industrialization must go through. In a sense, it is the link between the industry and the market. Only the packaged product can become a terminal product, and it can be put into practical application to provide services to customers. The industrial chain is interlocking and seamless.

2 LED package specificity

LED packaging technology is mostly developed and evolved on the basis of discrete device packaging technology, but it has great speciality. In general, the die of the discrete device is sealed within the package, and the package functions primarily to protect the die and complete the electrical interconnection. The LED package is to complete the output electrical signal, protect the normal operation of the die, output: visible light function, both electrical parameters, optical design and technical requirements, can not simply use the discrete device package for LED.